DA4520FR

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DESCRIPTION
DA 4520 is a Flame retardant epoxy prepreg tested in accordance to FAR 25.853 and designed for a temperature range of -67°F (-55° C) to 350°F (177°C), with a cure of 275°F (121°C) for one hour and or a cure of 350º F (177ºC) for 1 hour. This material needs to be post cured or cured to 350ºF to get the 350º Tg properties

PHYSICAL PROPERTIES:
Form: Modified epoxy impregnated fabric
Resin Content: 45 to 50% by Weight
Volatiles: Less than 1%
Separator: Release paper and poly film
Tack: Medium
Gel Time: 14 Minutes +/- 3 at 250°F
Shelf Life: One year at 0°F
Six months at 40°F Thirty days at 75°F

MECHANICAL PROPERTIES
The data supplied are averages obtained on 12 plies of DA 4520FR on 7781 glass cured one hour at 275°F (121°C) with a heat up rate of 5° per minute from room temperature.
Tensile Strength (ASTM D 638) @ 72°F (22°C) 49.28 KSI
Tensile Modulus @ 72°F (22°C) 3.05X10^6 PSI
Flexural Strength (ASTM D 790) @ 72ºF (22ºC) 68.23 KSI
Flexural Modulus @ 72ºF (22ºC) 3.39X10^6 PSI
Short Beam Shear(ASTM D 2344) @ 72ºF (22ºC) 6.12KSI
ADHESIVE PREPREGS FOR COMPOSITES MANUFACTURERS
P.O. BOX 264 1366 NORWICH RD. PLAINFIELD CT 06374
PHONE 860-564-7817 FAX 860-564-1535 www.prepregs.com
DA4520FR Epoxy Prepreg System

CURE CYCLE
DA 4520 is designed to cure in one hour at 275°F (121°C), however this system may be cured at 275°F for one hour and a post cure of 350°F for one hour. This system may also be cure at 350°F for one hour the reason for the higher temperature is to have the higher operating temperature. ) Depending on part size and number of plies. With larger scale structures an extended cure time may be necessary including a debulking process. Low, medium and high-pressure molding techniques may be used for curing. Recommended cure cycle is 50 psi (345 kPa); 3°F (1.7°C)/min ramp to 275°F (135°C); hold for 60 minutes, cool to 150ºF (66ºC)

STORAGE
Store material in a contaminate free container and store at O degrees F for extended storage. For shorter storage time requirements store at 40 degrees F, this enables quicker stabilization times.
APPLICATION
Remove material from cold storage at least 20 hours prior to use to allow for stabilization at room temperature. Keep the material wrapped to prevent moisture from condensing on the ad- hesive. If details are cut and replaced into cold storage, shorter stabilization times may be used. Cut the material to size, remove the release paper and apply to part or mold. Remove the separator paper and join the parts together. Parts are now ready to be bonded and may be cured in a press, autoclave, or vacuum bag in an oven. Apply at least 30 psi pressure.

CLEAN UP
The adhesive can be removed from non-bonding areas with ketones or methylene chloride.Be sure to follow all Material Safety Data Sheet (MSDS) guidelines for the solvent to be used.

CAUTION
This material contains epoxy resins and amines which may cause irritation to sensitive skin. Avoid contact with eyes or skin. If contact with skin occurs, wash as soon as possible with soap and water. If contact with eyes occurs, flush with water for 15 minutes. Do not handle or use this material until Material Safety Data Sheet has been read and understood. The user of this material is required to use the necessary protective equipment as directed by applicable state and federal laws when handling, curing, and grinding this material.

IMPORTANT NOTICE
Information in this data sheet has been obtained under controlled laboratory conditions and is believed to be accurate. Properties listed are typical values and are not intended for use in preparing specifications. Actual values may vary. No warranty is expressed or implied for which APCM assumes legal responsibility. APCM cannot be responsible for misapplication or handling and use under conditions beyond its control and under no circumstances shall be liable for incidental or consequential damage resulting from handling or use of this material