- Copper-Clad Prepreg
- In Stock
SG-4528-XXX
Short positioning sentence—what this prepreg is best for and why it’s reliable.
Overview
Write your description here. Explain the application, performance story, and what makes this laminate/prepreg dependable in production. Mention Dk/Df stability, lamination behavior, copper adhesion, etc.
Use 2–3 short paragraphs for clarity. You can add a short list of benefits below if helpful.
- Impedance control in multilayer builds
- High Tg supports reliable vias
- Clean press cycles, consistent flow
Quick Facts
- RoHS / REACH compliant
- UL 94V-0
- Stackup assistance available
Stable Dielectric
Consistent Dk/Df for predictable impedance.
High Tg / Low Z-CTE
Reliability through thermal cycles and via structures.
Clean Lamination
Controlled resin flow and copper adhesion.
Key Specifications
| Property | Typical | Method |
|---|---|---|
| Dielectric Constant (1 GHz) | 3.7 | IPC-TM-650 2.5.5.9 |
| Dissipation Factor (1 GHz) | ≤ 0.008 | IPC-TM-650 2.5.5.9 |
| Glass Transition (Tg) | ≈ 180 °C | DSC |
| CTE (Z, 50–260 °C) | ≤ 3.0 % | IPC-TM-650 2.4.24 |
| Resin Content | 44–52 % | — |
| Copper Weight | 1 oz | — |
| Flammability | UL 94V-0 | UL |
* Replace with exact values for this SKU.
Ordering & Availability
Summarize sizes, common layups, and any handling notes. Keep this as 1 paragraph.
- Standard sizes: 18″×24″ • 24″×36″ • custom
- Minimum order: 25 sheets (MOQs on request)
- Lead time: 3–5 business days ex-stock
Need a COA or RoHS/REACH statement? Add a note in your RFQ.